Earlier this week, Samsung announced that it would begin ramping up production of its 8GB HBM2 technology in order to address the rapidly expanding need for high-bandwidth memory in the market. HBM2 is used in high performance processors used for artificial intelligence, HPC (high performance compute), graphics, gaming, networking, and enterprise servers because of its low power, high throughput capability. HBM technology uses stacked memory dies that are vertically connected by TSVs (through silicon vias) to improve density and capacity, while also preventing overheating to guarantee higher reliability.